The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 04, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyuncheol Kim, Seoul, KR;

Yongseok Kim, Suwon-si, KR;

Hyeoungwon Seo, Yongin-si, KR;

Sungwon Yoo, Hwaseong-si, KR;

Kyunghwan Lee, Seoul, KR;

Jaeho Hong, Hwaseong-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2023.01); H01L 29/423 (2006.01); H10B 63/00 (2023.01);
U.S. Cl.
CPC ...
H10N 70/8265 (2023.02); H10B 63/845 (2023.02); H10N 70/841 (2023.02); H10N 70/8836 (2023.02); H10N 70/884 (2023.02); H01L 29/4234 (2013.01);
Abstract

A vertical variable resistance memory device including gate electrodes spaced apart from each other in a first direction on a substrate, each of the gate electrodes including graphene and extending in a second direction, the first direction being substantially perpendicular to an upper surface of the substrate and the second direction being substantially parallel to the upper surface of the substrate; first insulation patterns between the gate electrodes, each of the first insulation patterns including boron nitride (BN); and at least one pillar structure extending in the first direction through the gate electrodes and the first insulation patterns on the substrate, wherein the at least one pillar structure includes a vertical gate electrode extending in the first direction; and a variable resistance pattern on a sidewall of the vertical gate electrode.


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