The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Aug. 13, 2019
Intel Corporation, Santa Clara, CA (US);
Jieying Kong, Chandler, AZ (US);
Srinivas Pietambaram, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include hybrid cores for electronic packaging applications. In an embodiment, a package substrate comprises a plurality of glass layers and a plurality of dielectric layers. In an embodiment, the glass layers alternate with the dielectric layers. In an embodiment, a through-hole through the plurality of glass layers and the plurality of dielectric layers is provided. In an embodiment a conductive through-hole via is disposed in the through-hole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile