The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Apr. 14, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

H. Jim Fulford, Albany, NY (US);

Mark I. Gardner, Albany, NY (US);

Partha Mukhopadhyay, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/8234 (2006.01); H01L 27/092 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823814 (2013.01); H01L 21/823418 (2013.01); H01L 21/823487 (2013.01); H01L 21/823885 (2013.01); H01L 27/092 (2013.01); H01L 29/456 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 29/78642 (2013.01);
Abstract

Structures and methods are disclosed in which a layer stack can be formed with a plurality of layers of a metal, where each of the layers of metal can be separated by a layer of a dielectric. An opening in the layer stack can be formed such that a semiconductor layer beneath the plurality of layers of the metal is uncovered. One or more vertical channel structures can be formed within the opening by epitaxial growth. The vertical channel structure can include a vertically oriented transistor. The vertical channel structure can include an interface of a silicide metal with a first metal layer of the plurality of metal layers. The interface can correspond to one of a source or a drain connection of a transistor. The silicide metal can be annealed above a temperature threshold to form a silicide interface between the vertical channel structure and the first metal layer.


Find Patent Forward Citations

Loading…