The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Aug. 16, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Norihiko Amikura, Miyagi, JP;

Masatomo Kita, Miyagi, JP;

Masahiro Dogome, Miyagi, JP;

Takami Fukasawa, Yamanashi, JP;

Daisuke Hayashi, Yamanashi, JP;

Toshiaki Toyomaki, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); B25J 11/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); B25J 11/0095 (2013.01); H01L 21/6831 (2013.01); H01L 21/6835 (2013.01); H01L 21/6838 (2013.01);
Abstract

A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape is disclosed. The consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer. The transfer device comprises an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, an arm configured to move the end effector, and a controller configured to control the arm, to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position when transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector when transferring the wafer.


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