The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Jan. 23, 2024
Eliyan Corporation, Santa Clara, CA (US);
Ramin Farjadrad, Los Altos, CA (US);
Eliyan Corporation, Santa Clara, CA (US);
Abstract
Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a package substrate and an interposer disposed on a portion of the package substrate. A first integrated circuit (IC) chip is disposed on the interposer. A first memory device is disposed on the interposer and includes a first port interface including an interposer-compliant mechanical interface for coupling to the first IC chip via a first set of traces formed in the interposer. A second port interface includes a non-interposer-compliant mechanical interface for coupling to an off-interposer device. Transactions between the first IC chip and the off-interposer device pass through the first port interface and the second port interface of the first memory device.