The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Aug. 14, 2019
Applicant:
Asml Netherlands B.v., Veldhoven, NL;
Inventors:
Fuming Wang, Santa Clara, CA (US);
Stefan Hunsche, Santa Clara, CA (US);
Wei Fang, Milpitas, CA (US);
Assignee:
ASML NETHERLANDS B.V., Veldhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G06F 18/214 (2023.01); G06T 7/00 (2017.01); G06T 7/73 (2017.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G03F 7/7065 (2013.01); G03F 7/70625 (2013.01); G03F 7/70633 (2013.01); G06F 18/214 (2023.01); G06T 7/0004 (2013.01); G06T 7/73 (2017.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30168 (2013.01); H01J 37/28 (2013.01);
Abstract
A method for correcting metrology data of a patterning process. The method includes obtaining (i) metrology data of a substrate subjected to the patterning process and (ii) a quality metric (e.g., a focus index) that quantifies a quality of the metrology data of the substrate; establishing a correlation between the quality metric and the metrology data; and determining a correction to the metrology data based on the correlation between the quality metric and the metrology data.