The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Aug. 03, 2023
Eliyan Corporation, Santa Clara, CA (US);
Ramin Farjadrad, Los Altos, CA (US);
Syrus Ziai, Los Altos, CA (US);
Curtis McAllister, Los Altos, CA (US);
Kevin Donnelly, Santa Cruz, CA (US);
Eliyan Corporation, Santa Clara, CA (US);
Abstract
Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a package substrate and an integrated circuit (IC) processor chip disposed on the package substrate. The IC processor chip includes a data interface configured to support N channels. A scalable high bandwidth memory (HBM) is coupled to the IC processor chip. The scalable HBM includes a first HBM device disposed on the package substrate with a first primary data interface that supports a first set of N/2 data channels and a first data transfer rate. A second HBM device is disposed on the package substrate and supports a second set of N/2 data channels and a second data transfer rate. The first HBM device and the second HBM device are configured to collectively support the full N channels and an aggregate data rate that is a sum of the first data rate and the second data rate.