The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jan. 19, 2023
Disco Corporation, Tokyo, JP;
Yasukuni Nomura, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A measuring method includes storing thickness data of each of chips held on a holding surface of a holding table, the thickness data being obtained by measurement of thicknesses of portions of the chip at a plurality of measurement points and representing the thicknesses measured at the measurement points in association with positions of the measurement points in a predetermined plane corresponding to a reverse side of the wafer, storing positions of central lines of dividing grooves in the predetermined plane in captured images of reverse sides of the chips, setting, in a periphery of each of the chips, a thickness data unreferencing zone including measurement points where the thickness data will not be referenced in calculating the thickness of the chip, and calculating, for each of the chips, an average value of thicknesses at the measurement points except for the measurement points included in the thickness data unreferencing zone.