The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Jul. 05, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Heng Wu, Guilderland, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Alexander Reznicek, Troy, NY (US);

Lan Yu, Voorheesville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/165 (2006.01); H01L 29/267 (2006.01); H01L 29/32 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/02532 (2013.01); H01L 21/02603 (2013.01); H01L 29/0673 (2013.01); H01L 29/165 (2013.01); H01L 29/267 (2013.01); H01L 29/32 (2013.01); H01L 29/42392 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/66742 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01);
Abstract

Strained semiconductor FET devices with epitaxial quality improvement are provided. In one aspect, a semiconductor FET device includes: a substrate; at least one device stack including active layers oriented horizontally one on top of another on the substrate; gates surrounding at least a portion of each of the active layers; gate spacers alongside the gates; and source/drains, interconnected by the active layers, on opposite sides of the gates, wherein the source/drains are offset from the gates by inner spacers, wherein the source/drains include an epitaxial material having a low defect density which induces strain in the active layers, and wherein the gate spacers are formed from a same material as the inner spacers. A method of forming the semiconductor FET device using a spacer last process is also provided.


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