The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Dec. 03, 2021
Tokyo Electron Limited, Tokyo, JP;
Lars Liebmann, Mechanicsville, NY (US);
Jeffrey Smith, Clifton Park, NY (US);
Daniel Chanemougame, Niskayuna, NY (US);
Paul Gutwin, Williston, VT (US);
Brian Cline, Austin, TX (US);
Xiaoqing Xu, Austin, TX (US);
David Pietromonaco, San Jose, CA (US);
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
Aspects of the present disclosure provide a multi-tier semiconductor structure. For example, the multi-tier semiconductor structure can include a lower semiconductor device tier, and a lower signal wiring structure electrically connected to the lower semiconductor device tier. The multi-tier semiconductor structure can further include a primary power delivery network (PDN) structure disposed over the lower semiconductor device tier and the lower signal wiring structure and electrically connected to the lower semiconductor device tier. The multi-tier semiconductor structure can further include an upper semiconductor device tier disposed over and electrically connected the first PDN structure, and an upper signal wiring structure disposed over the primary PDN structure and electrically connected to the upper semiconductor device tier.