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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12173219 B1

PDFFull Text
Date of Patent:
Dec. 24, 2024

Filed:

Sep. 25, 2018

Slurry and polishing method

Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Satoyuki Nomura, Tokyo, JP;

Tomohiro Iwano, Tokyo, JP;

Takaaki Matsumoto, Tokyo, JP;

Tomoyasu Hasegawa, Tokyo, JP;

Tomomi Kukita, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery LLP

Primary Examiner:

Pegah Parvini

Int. Cl.
CPC ...
C09K 3/14 (2006.01); B24B 37/04 (2012.01); C01F 17/235 (2020.01); C09G 1/02 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1454 (2013.01); B24B 37/042 (2013.01); C09G 1/02 (2013.01); C09K 3/1409 (2013.01); H01L 21/304 (2013.01); H01L 21/31053 (2013.01); H01L 22/26 (2013.01); C01F 17/235 (2020.01); C01P 2002/85 (2013.01); C01P 2004/64 (2013.01); C01P 2006/40 (2013.01);
Abstract

A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy.

Find Patent Forward Citations

Nomura, Satoyuki. (2024). Slurry and polishing method (U.S. Patent No. 12173219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12173219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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