The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Nov. 02, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 27/06 (2006.01); H01L 27/22 (2006.01); H10B 61/00 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 5/04 (2013.01); G11C 5/06 (2013.01); H01L 23/5384 (2013.01); H01L 24/14 (2013.01); H01L 27/0688 (2013.01); H10B 61/00 (2023.02);
Abstract
A semiconductor package includes a processor die, a storage module and a package substrate. The storage module includes an array of cache units and an array of memory units stacked over one another, and electrically connected to the processor die, wherein the array of cache units is configured to hold copies of data stored in the array of memory units and frequently used by the processor die. The package substrate is on which the processor die and the storage module are disposed.