The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Sep. 15, 2021
Laser Imaging Systems Gmbh, Jena, DE;
Christian Schwarz, Jena, DE;
Jonas Burghoff, Apolda, DE;
Stefan Heinemann, Jena, DE;
Holger Wagner, Jena, DE;
Steffen Rücker, Großlöbichau, DE;
Frank Jugel, Erfurt, DE;
Laser Imaging Systems GmbH, Jena, DE;
Abstract
The invention is directed to a device for exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings and to a method for converting registration data into direct exposure data. The object of the invention, to find an improved exposure control in direct exposure methods for two-dimensional structures in photosensitive layers which permits a registration of target marks independent from defined locations of the target marks, is met according to the invention in that a plurality of entocentric cameras are arranged in a registration unit () in linear alignment transverse to the one-dimensional movement of the substrate () to form a gapless linear scanning area () over a predetermined width of the substrate (). The angles of view of adjacent entocentric cameras have an overlapping region along the linear scanning area () in which redundant image captures of the substrate () of the adjacent cameras () are detectable, and the computing unit () has means for calculating the position of the target marks from the redundant image captures of the adjacent entocentric cameras additionally using a height position of the target marks which is determined by triangulation of a distance of the substrate surface ().