The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Jul. 27, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzu-Hao Chiang, Hsinchu, TW;

Wun-Jie Lin, Hsinchu, TW;

Jam-Wem Lee, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 29/0649 (2013.01); H01L 29/0692 (2013.01);
Abstract

A semiconductor device includes a substrate. The semiconductor device further includes a doped well in the substrate, wherein the doped well comprises a first concentration of dopants of a first type in the substrate. The semiconductor device further includes a doped region in the substrate, wherein the doped region comprises a second concentration of the dopants of the first type, the doped region extends around the doped well, and the doped region is electrically insulated from the doped well. The semiconductor device further includes an active area, and wherein the active area comprises an emitter region and a collector region, wherein the emitter region is electrically connected to the doped region. The semiconductor device further includes a deep trench isolation (DTI) structure extending through the active area and between the emitter region and the collector region.


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