The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Dec. 05, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yan Chen, Fremont, CA (US);

Xinkang Tian, Fremont, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 3/28 (2006.01); G01N 21/71 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); G06T 7/00 (2017.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/66 (2006.01); G01N 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); G01J 3/2823 (2013.01); G01N 21/71 (2013.01); G01N 21/8806 (2013.01); G01N 21/9501 (2013.01); G06T 7/0004 (2013.01); H01J 37/32963 (2013.01); H01L 21/3065 (2013.01); G01J 2003/2826 (2013.01); G01N 2021/8461 (2013.01); G01N 2021/8845 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/24514 (2013.01); H01J 2237/334 (2013.01);
Abstract

Disclosed are embodiments of an improved apparatus and system, and associated methods for optically diagnosing a semiconductor manufacturing process. A hyperspectral imaging system is used to acquire spectrally-resolved images of emissions from the plasma, in a plasma processing system. Acquired hyperspectral images may be used to determine the chemical composition of the plasma and the plasma process endpoint. Alternatively, a hyperspectral imaging system is used to acquire spectrally-resolved images of a substrate before, during, or after processing, to determine properties of the substrate or layers and features formed on the substrate, including whether a process endpoint has been reached; or before or after processing, for inspecting the substrate condition.


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