The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Mar. 20, 2024
Applicant:

Celestial Ai Inc., Santa Clara, CA (US);

Inventors:

Philip Winterbottom, San Jose, CA (US);

David Lazovsky, Los Gatos, CA (US);

Ankur Aggarwal, Pleasanton, CA (US);

Martinus Bos, San Jose, CA (US);

Subal Sahni, La Jolla, CA (US);

Assignee:

Celestial AI Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02F 1/015 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4295 (2013.01); G02B 6/4246 (2013.01); G02B 6/428 (2013.01); G02F 1/0157 (2021.01); G02B 6/4245 (2013.01);
Abstract

An implementation provides a package that includes a first die including a bridging element, an analog/mixed-signal (AMS) die, and a general die. The first die includes: a first photonic transceiver portion, a first die first interconnect region, and an optical interface (OI). The AMS die includes a second photonic transceiver portion, an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region; and an AMS die second interconnect region on a second surface of the AMS die. The general die includes a third photonic transceiver portion, and a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion.


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