The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Feb. 06, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Ming-Fa Chen, Taichung, TW;
Chao-Wen Shih, Hsinchu County, TW;
Tzuan-Horng Liu, Taoyuan, TW;
Jen-Li Hu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 21/76807 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 23/645 (2013.01); H01L 24/03 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01);
Abstract
Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn.