The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jan. 13, 2022
Applicants:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

National Yang Ming Chiao Tung University, Hsinchu, TW;

Inventors:

Chiung-Yuan Lin, Hsinchu County, TW;

Tsung-Fu Yang, Hsinchu, TW;

Weicheng Chu, Tainan, TW;

Ching Liang Chang, Tainan, TW;

Chen Han Chou, Tainan, TW;

Chia-Ho Yang, Taoyuan, TW;

Tsung-Kai Lin, Nantou County, TW;

Tsung-Han Lin, Hsinchu, TW;

Chih-Hung Chung, Hsinchu, TW;

Chenming Hu, Oakland, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/02 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/76 (2006.01); H01L 29/778 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823412 (2013.01); H01L 21/02568 (2013.01); H01L 29/24 (2013.01); H01L 29/66969 (2013.01); H01L 29/7606 (2013.01); H01L 29/778 (2013.01); H01L 29/78618 (2013.01);
Abstract

A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.


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