The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Apr. 25, 2023
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Masanori Nakayama, Toyama, JP;

Katsunori Funaki, Toyama, JP;

Tatsushi Ueda, Toyama, JP;

Yasutoshi Tsubota, Toyama, JP;

Yuichiro Takeshima, Toyama, JP;

Hiroto Igawa, Toyama, JP;

Yuki Yamakado, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); H01L 21/67 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76886 (2013.01); H01L 21/321 (2013.01); H01L 21/67115 (2013.01); H01L 21/76862 (2013.01);
Abstract

There is provided a technique that includes: preparing the substrate including a silicon-containing film and a metal film composed of a metal element, which includes at least one selected from the group of tungsten, titanium, ruthenium, and molybdenum and, which are formed on a surface of the substrate; and simultaneously performing modifying the metal film and modifying the silicon-containing film by supplying reactive species, which are generated by plasma-exciting a processing gas containing hydrogen and oxygen, to the substrate.


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