The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Mar. 12, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Thomas Liljeberg, San Jose, CA (US);

Andrew C. Alduino, San Jose, CA (US);

Ravindranath Vithal Mahajan, Chandler, AZ (US);

Ling Liao, Fremont, CA (US);

Kenneth Brown, Tempe, AZ (US);

James Jaussi, El Dorado Hills, CA (US);

Bharadwaj Parthasarathy, San Jose, CA (US);

Nitin A Deshpande, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 25/16 (2023.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G02B 6/4268 (2013.01); G02B 6/428 (2013.01); H01L 23/3675 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H04B 10/40 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01);
Abstract

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.


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