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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12148704 B1

PDFFull Text
Date of Patent:
Nov. 19, 2024

Filed:

Jul. 20, 2023

Electrical interconnect bridge

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Srinivas V. Pietambaram, Gilbert, AZ (US);

Rahul N. Manepalli, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt P.C.

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/02 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 21/84 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/15 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2023.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 23/5383 (2013.01); H01L 24/13 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/181 (2013.01);
Abstract

Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.

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