The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Feb. 17, 2023
Applicant:

Tahoe Research, Ltd., Dublin, IE;

Inventors:

Han Wui Then, Portland, OR (US);

Sansaptak Dasgupta, Hillsboro, OR (US);

Marko Radosavljevic, Portland, OR (US);

Sanaz K. Gardner, Hillsboro, OR (US);

Assignee:

Tahoe Research, Ltd., Dublin, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5222 (2013.01); H01L 21/762 (2013.01); H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H01L 23/53295 (2013.01); H01L 29/0649 (2013.01);
Abstract

Embodiments of the invention include a microelectronic device that includes a substrate, at least one dielectric layer on the substrate and a plurality of conductive lines within the at least one dielectric layer. The microelectronic device also includes an air gap structure that is located below two or more of the plurality of conductive lines.


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