The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Aug. 09, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); H01L 21/76805 (2013.01); H01L 21/7684 (2013.01); H01L 21/76843 (2013.01); H01L 21/76874 (2013.01); H01L 21/76879 (2013.01);
Abstract
Provided is an interconnect structure including: a first conductive feature, disposed in a first dielectric layer; a second conductive feature, disposed over the first conductive feature and the first dielectric layer; a via, disposed between the first and second conductive features and being in direct contact with the first and second conductive features; and a barrier structure, lining a sidewall and a portion of a bottom surface of the second conductive feature, a sidewall of the via, a portion of a top surface of the first conductive feature, and a top surface of the first dielectric layer.