The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
May. 13, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Yoshifumi Amano, Koshi, JP;
Kazuhiro Aiura, Koshi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B05B 9/00 (2006.01); B05C 5/02 (2006.01); B05C 11/10 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); B05B 9/00 (2013.01); B05C 5/0204 (2013.01); B05C 11/1013 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/68 (2013.01);
Abstract
A substrate processing apparatus includes a holder, a nozzle arm and a position adjusting device. The holder is configured to hold a substrate. The nozzle arm has a nozzle configured to supply a processing liquid to a peripheral portion of the substrate. The position adjusting device is provided at the nozzle arm and is configured to adjust a position of the substrate to a given position on the holder.
Amano, Yoshifumi. (2024). Substrate processing apparatus and substrate processing method (U.S. Patent No. 12142496). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12142496
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile