The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Dec. 20, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Mark I. Gardner, Albany, NY (US);

H. Jim Fulford, Albany, NY (US);

Partha Mukhopadhyay, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H10B 41/27 (2023.01); H10B 41/41 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H10B 41/27 (2023.02); H10B 41/41 (2023.02); H10B 43/40 (2023.02);
Abstract

Three-dimensional (3D) memory structures and methods to manufacture 3D memory structures are disclosed. A method includes forming a stack of layers including a first sub-stack for a first transistor structure, comprised of a first conductive layer, a gate layer, and a second source/drain layer. The stack of layers can include a second sub-stack for a memory structure positioned on the first sub-stack, the second sub-stack including at least one layer of conductive material and at least one layer of non-conductive material, and a third sub-stack for a second transistor structure. The method includes forming a channel opening in the stack of layers, providing a first channel structure within the channel opening, forming a memory dielectric layer in the channel opening and aligned with the memory structure, and providing a second channel structure in the channel opening in contact with the memory dielectric layer and aligned with the second transistor structure.


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