The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jan. 25, 2022
Applicant:

Sien (Qingdao) Integrated Circuits Co., Ltd., Shandong, CN;

Inventors:

Min-Hwa Chi, Qingdao, CN;

Zhaosheng Meng, Qingdao, CN;

Xian Zhang, Qingdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 21/31133 (2013.01); H01L 21/31138 (2013.01); H01L 21/76802 (2013.01); H01L 21/76829 (2013.01); H01L 29/401 (2013.01);
Abstract

The present invention relates to a method of forming contact holes of a CMOS device and a method of making a CMOS device. Because a carbon cap layer or a carbon rich layer is formed on a etching stop layer, when etching reaches the etching stop layer with less depth, great polymer protecting the etching stop layer from etching will be formed in the etching stop layer. As such, when etching reaches the contact holes with more depth, the contact holes with less depth may be protected from over-etching until etching the contact holes with more depth is finished. Over-etching may be avoided, and meanwhile the contact holes with more depth may be fully etched to avoid from under-etching.


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