The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Apr. 01, 2022
Applicant:

Hefechip Corporation Limited, Hong Kong, CN;

Inventors:

Liang Li, Guilderland, NY (US);

Chunhui Low, Saratoga Springs, NY (US);

Huang Liu, Mechanicville, NY (US);

Assignee:

HEFECHIP CORPORATION LIMITED, Sai Ying Pun, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 21/8238 (2006.01); H01L 27/12 (2006.01); H01L 49/02 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 28/90 (2013.01); H01L 21/823821 (2013.01); H01L 21/845 (2013.01); H01L 27/1203 (2013.01); H10B 12/056 (2023.02); H10B 12/30 (2023.02); H10B 12/36 (2023.02); H10B 12/37 (2023.02);
Abstract

A method to form a fin structure on deep trenches (DTs) for a semiconductor device includes the following steps: A buried oxide layer (BOX) having the DTs, and silicon polies in the DTs is provided. A fin on the BOX and the silicon polies having poly fences is provided. A first mask is disposed on the fin. A liner is disposed on the BOX and the first mask, wherein the liner has a first part above the fin, a second part at lateral sides of the fin and a third part on the DTs and the BOX. A second mask is disposed on the first and the second parts of the liner. The second mask and the third parts of the liner are removed to reveal the first and the second parts of the liner. The poly fences are removed and spacers at the lateral sides are formed.


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