The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Oct. 28, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Zhiguo Qian, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Kemal Aygün, Tempe, AZ (US);
Jieying Kong, Chandler, AZ (US);
Brandon C. Marin, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 23/66 (2013.01);
Abstract
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a first buildup layer and a second buildup layer over the first buildup layer. In an embodiment, a void is disposed through the second buildup layer. In an embodiment the electronic package further comprises a first pad over the second buildup layer. In an embodiment, the first pad covers the void.