The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Oct. 20, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Michael Hell, Erlangen, DE;

Rudolf Elpelt, Erlangen, DE;

Caspar Leendertz, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/04 (2006.01); H01L 21/76 (2006.01); H01L 21/761 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/808 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 21/0465 (2013.01); H01L 21/049 (2013.01); H01L 21/0495 (2013.01); H01L 21/7602 (2013.01); H01L 21/761 (2013.01); H01L 29/1608 (2013.01); H01L 29/6606 (2013.01); H01L 29/66068 (2013.01); H01L 29/7813 (2013.01); H01L 29/8083 (2013.01); H01L 29/872 (2013.01);
Abstract

A semiconductor device includes: a SiC substrate; a device structure in or on the SiC substrate and subject to an electric field during operation of the semiconductor device; a current-conduction region of a first conductivity type in the SiC substrate adjoining the device structure; and a shielding region of a second conductivity type laterally adjacent to the current-conduction region and configured to at least partly shield the device structure from the electric field. The shielding region has a higher net doping concentration than the current-conduction region, and has a length (L) measured from a first position which corresponds to a bottom of the device structure to a second position which corresponds to a bottom of the shielding region. The current-conduction region has a width (d) measured between opposing lateral sides of the current-conduction region, and L/d is in a range of 1 to 10.


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