The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Dec. 19, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Bo Liao, Hsinchu, TW;

Wei-De Ho, Hsinchu, TW;

Cheng-Ting Chung, Hsinchu, TW;

Szuya Liao, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823871 (2013.01); H01L 27/124 (2013.01); H01L 27/1266 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/66787 (2013.01); H01L 29/78696 (2013.01);
Abstract

A method includes forming a first transistor and a second transistor over a semiconductor substrate, wherein the first transistor and the second transistor are vertically stacked. The method further includes exposing a backside of a first gate stack of the first transistor; forming a backside gate etch stop layer (ESL) on the backside of the first gate stack; patterning a contact opening through the backside gate ESL to expose the first gate stack; and forming a backside gate contact in the contact opening. The backside gate contact extends through the backside gate ESL to electrically connect to the first gate stack.


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