The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
May. 25, 2020
Showa Denko Materials Co., Ltd., Tokyo, JP;
Akihiro Nakamura, Tokyo, JP;
Yuji Takase, Tokyo, JP;
Hayato Sawamoto, Tokyo, JP;
Yoshikazu Suzuki, Tokyo, JP;
Shuji Nomoto, Tokyo, JP;
Shota Okade, Tokyo, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.