The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Feb. 07, 2022
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventors:
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/482 (2023.02); H10B 12/30 (2023.02);
Abstract
A method of manufacturing a semiconductor structure and a semiconductor structure are disclosed in embodiments of the present disclosure. The method of manufacturing a semiconductor includes: providing a base; and forming an electrical contact layer, a bottom barrier layer, and a conductive layer that are sequentially stacked on the base, where a material of the conductive layer includes molybdenum.
Quick Actions:
Ping, Er-Xuan. (2024). Method of manufacturing semiconductor structure and semiconductor structure (U.S. Patent No. 12096617). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12096617
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile