The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Aug. 30, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Yao Lin, New Taipei, TW;

Chieh-Ning Feng, Taichung, TW;

Hsiao Wen Lee, Hsinchu, TW;

Ming-Ching Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823481 (2013.01); H01L 21/823456 (2013.01); H01L 27/088 (2013.01);
Abstract

A method includes forming a dielectric fin over a substrate between a first semiconductor fin and a second semiconductor fin. The first and second semiconductor fins, and the dielectric fin all extend along a first lateral direction. The method includes forming a dummy gate structure that extends along a second lateral direction and includes a first portion and a second portion. The first and second portions overlay the first and second semiconductor fins, respectively, and separate from each other with the dielectric fin. The method includes removing upper sidewall portions of the dielectric fin. The method includes replacing the first and second portions of the dummy gate structure with a first and second active gate structures, respectively.


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