The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Jul. 08, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yu-Lien Huang, Hsinchu, TW;
Ching-Feng Fu, Hsinchu, TW;
Huan-Just Lin, Hsinchu, TW;
Che-Ming Hsu, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76837 (2013.01); H01L 21/76897 (2013.01); H01L 23/5226 (2013.01); H01L 21/02112 (2013.01); H01L 21/0212 (2013.01); H01L 21/02164 (2013.01); H01L 21/02205 (2013.01); H01L 21/02208 (2013.01); H01L 21/02274 (2013.01); H01L 23/5329 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract
A method is provided for sealing a seam in a self-aligned contact (SAC) layer that is disposed on a gate of a semiconductor structure. The method includes depositing a filler in the seam to seal the seam.
Huang, Yu-Lien. (2024). Method for sealing a seam, semiconductor structure, and method for manufacturing the same (U.S. Patent No. 12094768). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12094768
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile