The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jul. 07, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chun-Yen Chang, Hsinchu, TW;

Yu-Tien Shen, Hsinchu, TW;

Chih-Kai Yang, Hsinchu, TW;

Ya-Hui Chang, Hsinchu, TW;

Shih-Ming Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32623 (2013.01); H01J 37/32715 (2013.01); H01J 37/32935 (2013.01); H01L 21/68 (2013.01); H01L 21/6833 (2013.01); H01J 2237/334 (2013.01);
Abstract

The current disclosure includes a plasma etching system that includes a movable plasma source and a moveable wafer stage. A relative position between the movable plasma source and the movable wafer stage can be varied to set up an angle along which plasma particles of the plasma hits a wafer positioned on the wafer stage.


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