The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Nov. 08, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chung-Hui Chen, Hsinchu, TW;

Tzu Ching Chang, Hsinchu, TW;

Wan-Te Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/392 (2020.01); G03F 1/70 (2012.01); G06F 30/3953 (2020.01); G06F 30/398 (2020.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G03F 1/70 (2013.01); G06F 30/3953 (2020.01); G06F 30/398 (2020.01); H01L 23/5226 (2013.01);
Abstract

A method (of forming a semiconductor device) includes: forming an active area structure extending in a first direction; forming gate structures over the active area structure and extending in a second direction substantially perpendicular to the first direction; forming contact-source/drain (CSD) conductors over the active area structure, interleaved with corresponding ones of the gate structures, and extending in the second direction; and forming first conductive segments in a first layer of metallization (M_1st layer) over the active area structure and extending in the first direction, the first conductive segments including a first gate-signal-carrying (GSC) conductor which overlaps the active area structure.


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