Non-volatile memory device including common source line tapping wire connected to common source line plate by vias on lower metal line and through-hole vias

Abstract

A non-volatile memory device including a memory cell region over a peripheral circuit region. The memory cell region includes an upper substrate, channel structures extending in a vertical direction, and a first upper metal line extending in a first direction. The peripheral circuit region includes a first lower metal line extending in a second direction, and first and second via structures on the first lower metal line, a top surface of the second via structure in contact with the upper substrate. The memory cell region includes a first through-hole via structure passing through the upper substrate and the first via structure, and electrically connecting the first upper metal line to the first lower metal line; and the first upper metal line is electrically connected to the upper substrate through the first through-hole via structure, the first lower metal line, and the second via structure.