The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Sep. 21, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chanro Park, Clifton Park, NY (US);

Koichi Motoyama, Clifton Park, NY (US);

Kenneth Chun Kuen Cheng, Shatin, HK;

Chih-Chao Yang, Glenmont, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76846 (2013.01); H01L 21/76831 (2013.01); H01L 21/76849 (2013.01); H01L 21/76865 (2013.01); H01L 21/76883 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 23/53238 (2013.01);
Abstract

A dielectric layer is located on top of and in contact with a substrate. A conductive line located within the dialectic layer. A barrier layer on top of an in contact with the dielectric layer. The barrier layer is below the conductive line. A liner layer on top of and in contact with the barrier layer and below and in contact with the conductive line. A metal liner on top of and in contact with the conductive line. A capping layer on top of and in contact with the dielectric layer, the barrier layer, the liner layer, and the metal liner.


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