The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Sep. 28, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Kang You, Hefei, CN;

Jie Bai, Hefei, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/764 (2006.01); G11C 5/06 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 21/764 (2013.01); H01L 21/76224 (2013.01); H01L 21/7682 (2013.01); H01L 21/76837 (2013.01); H01L 23/5283 (2013.01); H10B 12/315 (2023.02); H10B 12/482 (2023.02); H10B 12/488 (2023.02); G11C 5/063 (2013.01);
Abstract

The present application relates to a formation method for an air spacer layer and a semiconductor structure. The formation method for an air spacer layer includes: forming a first structure on a substrate and forming a second structure on the substrate, the second structure being located on a side surface of the first structure, a first trench being formed between the second structure and the first structure, and the second structure being exposed in the first trench; and growing, by an epitaxial growth process, an epitaxial layer on the second structure exposed in the first trench, the epitaxial layer not filling up the first trench, and an unfilled portion of the first trench forming the air spacer layer.


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