The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Feb. 14, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Andrea Redaelli, Calolziocorte, IT;

Anna Maria Conti, Milan, IT;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 27/11514 (2017.01); H01L 45/00 (2006.01); H10B 53/20 (2023.01); H10B 63/00 (2023.01); H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
H10B 63/84 (2023.02); H01L 21/32133 (2013.01); H01L 21/76837 (2013.01); H01L 21/76892 (2013.01); H01L 23/528 (2013.01); H10B 53/20 (2023.02); H10B 63/24 (2023.02); H10N 70/021 (2023.02); H10N 70/231 (2023.02); H10N 70/826 (2023.02); H10N 70/841 (2023.02); H10N 70/8825 (2023.02);
Abstract

Methods, systems, and devices for access line formation for a memory array are described. The techniques described herein may be used to fabricate access lines for one or more decks of a memory array. In some examples, one or more access lines of a deck may be formed using an independent processing step. For example, different fabrication processes may be used to form a plurality of access lines in a deck and to form the pillars (e.g., the memory cells) that are coupled with the access lines. In some examples, an offset between the access lines and the pillars may exist due to the components being fabricated in different processing steps.


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