The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Apr. 20, 2022
Applicant:

Changxin Memory Technologies, Inc., Anhui, CN;

Inventors:

Liang Wang, Hefei, CN;

Qian Xu, Hefei, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/05008 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/04941 (2013.01);
Abstract

A semiconductor structure and a method of manufacturing the semiconductor structure are provided. The semiconductor structure includes a substrate including a plurality of pads spaced apart from each other, a first groove, and a second groove connected with the first groove, the first and the second grooves located in the substrate. The first groove is located on the side of the second groove away from the plurality of pads, and the bottom of the second groove exposes a corresponding pad of the plurality of pads. The orthographic projection of the second groove on the substrate is located within the orthographic projection of the first groove on the substrate. A redistribution layer is disposed on a surface of the corresponding pad, the inner wall of the first groove, and the inner wall and the bottom of the second groove. The semiconductor structure prevents contamination or damage of test probes.


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