The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Jun. 07, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Po-Ju Chen, Hsinchu, TW;

Sheng-Jen Cheng, Tainan, TW;

Cha-Hsin Chao, Taipei, TW;

Chih-Teng Liao, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01); G01F 1/00 (2022.01); G01N 15/00 (2006.01); G01N 15/06 (2006.01); G01N 15/075 (2024.01); G01P 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01J 37/32935 (2013.01); H01L 21/68742 (2013.01); G01F 1/00 (2013.01); G01N 15/00 (2013.01); G01N 2015/0046 (2013.01); G01N 15/06 (2013.01); G01N 15/075 (2024.01); G01P 3/00 (2013.01); H01J 37/32715 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/202 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/24585 (2013.01);
Abstract

The present disclosure provides a method and a system therefore for processing wafer. The method includes: monitoring a distribution of particles in a chamber while processing the wafer; determining at least one parameter according to the distribution of the particles for configuring at least one device of the chamber; configuring the at least one device of the chamber according to the at least one parameter; and processing another wafer based on a recipe after configuring the at least one device of the chamber.


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