The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Jul. 31, 2023
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Isaho Kamata, Tokyo, JP;

Hidekazu Tsuchida, Tokyo, JP;

Norihiro Hoshino, Tokyo, JP;

Yuichiro Tokuda, Kariya, JP;

Takeshi Okamoto, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/00 (2006.01); C30B 25/02 (2006.01); C30B 25/10 (2006.01); C30B 29/36 (2006.01); C30B 33/00 (2006.01);
U.S. Cl.
CPC ...
C30B 29/36 (2013.01); C30B 25/00 (2013.01); C30B 25/02 (2013.01); C30B 25/10 (2013.01); C30B 33/00 (2013.01);
Abstract

A raw material gas is supplied to a space in which a silicon carbide seed crystal is placed. A silicon carbide single crystal is grown on the seed crystal by keeping a monosilane partial pressure at 4 kPa or more and heating the space to a temperature of 2400° C. to 2700° C. The temperature of the space and supply of the raw material gas are controlled such that a temperature gradient of a growth crystal surface of the silicon carbide single crystal in a radial direction is 0.1° C./mm or less, and a radius of curvature of the growth crystal surface is 4.5 m or more, thereby producing a silicon carbide single crystal ingot having a growth length of 3 mm or more and an internal stress of 10 MPa or less. The ingot is then cut into a silicon carbide single crystal wafer.


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