The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Aug. 25, 2020
Asml Netherlands B.v., Veldhoven, NL;
Yixiang Wang, Fremont, CA (US);
Shibing Liu, San Jose, CA (US);
Shanhui Cao, San Jose, CA (US);
Kangsheng Qiu, San Jose, CA (US);
Juying Dou, San Jose, CA (US);
Ying Luo, San Jose, CA (US);
Yinglong Li, San Jose, CA (US);
Qiang Li, Campbell, CA (US);
Ronald Van Der Wilk, Knegsel, NL;
Jan-Gerard Cornelis Van Der Toorn, Eindhoven, NL;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.