The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Apr. 09, 2021
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Xia Li, San Diego, CA (US);

Bin Yang, San Diego, CA (US);

Haining Yang, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01L 28/10 (2013.01); H01F 2017/0073 (2013.01);
Abstract

Disclosed is apparatus including a vertical spiral inductor. The vertical spiral inductor may include a plurality of dielectric layers formed on a substrate, a plurality of conductive layers, each of the plurality of conductive layers disposed on each of the plurality of dielectric layers, a plurality of insulating layers, each of the plurality of insulating layers disposed on each of the plurality of conductive layers, wherein each of the plurality of insulating layers separates each of the plurality of dielectric layers. A first spiral coil is arranged in a first plane perpendicular to the substrate, where the first spiral coil is formed of first portions of the plurality of conductive layers and a first set of vias of a plurality of vias, configured to connect the first portions of the plurality of conductive layers.


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