The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Sep. 28, 2020
Carl Zeiss Smt Gmbh, Oberkochen, DE;
Jens Timo Neumann, Aalen, DE;
Eugen Foca, Ellwangen, DE;
Ramani Pichumani, Palo Alto, CA (US);
Abhilash Srikantha, Neu-Ulm, DE;
Christian Wojek, Aalen, DE;
Thomas Korb, Schwaebisch Gmuend, DE;
Joaquin Correa, Oakland, CA (US);
Carl Zeiss SMT GmbH, Oberkochen, DE;
Abstract
A method includes obtaining at least one 2-D image dataset of semiconductor structures formed on a wafer including one or more defects during a wafer run of a wafer using a predefined fabrication process. The method also includes determining, based on at least one machine-learning algorithm trained on prior knowledge of the fabrication process and based on the at least one 2-D image dataset, one or more process deviations of the wafer run from the predefined fabrication process as a root cause of the one or more defects. A 3-D image dataset may be determined as a hidden variable.