The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Apr. 12, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Min Shin, Daejeon, KR;

Hun Jae Jang, Suwon-si, KR;

Seok Hoon Kim, Seongnam-si, KR;

Young-Hoo Kim, Yongin-si, KR;

In Gi Kim, Hwaseong-si, KR;

Tae-Hong Kim, Seoul, KR;

Kun Tack Lee, Suwon-si, KR;

Ji Hoon Cha, Seoul, KR;

Yong Jun Choi, Gwacheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 7/00 (2006.01); B08B 3/10 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B08B 7/0042 (2013.01); B08B 3/10 (2013.01); B08B 7/0064 (2013.01); H01L 21/31111 (2013.01); H01L 21/67051 (2013.01); H01L 21/67075 (2013.01); H01L 21/67098 (2013.01); H01L 21/67248 (2013.01); H01L 21/68764 (2013.01);
Abstract

A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.


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