The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 21, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yu-Xuan Huang, Hsinchu, TW;
Ching-Wei Tsai, Hsinchu, TW;
Hou-Yu Chen, Zhubei, TW;
Kuan-Lun Cheng, Hsin-chu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a substrate and semiconductor material layers stacked along a first direction over the substrate and spaced apart from each other. The semiconductor structure also includes inner spacers stacked along the first direction in spaces between the semiconductor material layers and a gate structure extending along a second direction and wrapping around the semiconductor material layers. In addition, the gate structure abuts a first side of the inner spacers. The semiconductor structure also includes a source/drain structure formed over the isolating feature and abutting the second side of the inner spacers.