The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Oct. 09, 2020
Intel Corporation, Santa Clara, CA (US);
Anshuman Thakur, Beaverton, OR (US);
Dheeraj Subareddy, Portland, OR (US);
Md Altaf Hossain, Portland, OR (US);
Ankireddy Nalamalpu, Portland, OR (US);
Mahesh Kumashikar, Bangalore, IN;
Sandeep Sane, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.