The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 01, 2021
Methods of detecting non-conforming substrate processing events during chemical mechanical polishing
Applied Materials, Inc., Santa Clara, CA (US);
Jeonghoon Oh, Saratoga, CA (US);
Ashish Bhushan, Bangalore, IN;
Jamie Stuart Leighton, Palo Alto, CA (US);
John Anthony Garcia, San Jose, CA (US);
Stephen Thomas Cormier, Leominster, MA (US);
Nick Joseph Jackson, Broadway, NC (US);
Manoj Balakumar, Bangalore, IN;
Nandkishore Patidar, Barwaha, IN;
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure generally relate to chemical mechanical polishing systems (CMP) systems and processes used in the manufacturing of electronic devices. In particular, embodiments herein relate to methods of detecting non-conforming substrate processing events during a polishing process. In one embodiment, a method of processing a substrate on a polishing system includes urging a surface of a silicon carbide substrate against a polishing pad in the presence of a polishing fluid, determining a temperature of the polishing pad using a temperature sensor that is positioned above the platen, monitoring the temperature of the polishing pad, and, if the change in polishing pad temperature reaches a threshold value, initiating a response using a controller of the polishing system.